Last edited 2 weeks ago

STM32 MPU OpenSTLinux release note - v5.1.0

Applicable for STM32MP13x lines, STM32MP15x lines, STM32MP25x lines

This article describes the content of OpenSTLinux distribution software release version openstlinux-6.1-yocto-mickledore-mpu-v24.06.26, which is part of the STM32 MPU ecosystem release note - v5.1.0.

1. Intended audience[edit source]

The targeted audience is STM32MP1 series and STM32MP25x lines More info.png customers or partners.

2. Delivery scope and purpose[edit source]

The OpenSTLinux distribution is a Linux® distribution based on the OpenEmbedded build Framework. It runs on the Arm® Cortex® processors, and is a fundamental part of the STM32MPU Embedded Software distribution. This delivery of OpenSTLinux distribution is part of STM32 MPU Ecosystem v5.1.0 (see the STM32 MPU ecosystem release note - v5.1.0).

3. Licensing[edit source]

This software package is licensed under a LIMITED LICENSE AGREEMENT FOR ST MATERIALS EVALUATION (LLA). Customers may not use this package except in compliance with the software license agreement (SLA).

All packages use the same source components. All components and their respective licenses are listed here.

4. Supported hardware[edit source]

This software delivery is compatible with the following boards:

STM32MP13 boards
Boards PCBs list Main features Ordering
STM32MP135x-DK.png
STM32MP135F-DK Discovery kit
  • MB1635 (motherboard)
  • MB1897 (camera module board)
  • STM32MP135FAF7[1] Rev.Y
    • Arm®-based Cortex®-A7 1 GHz
    • Secure boot and cryptography
    • 4-Gbit DDR3L, 16 bits, 533 MHz
  • ST PMIC STPMIC1
  • 4.3" TFT 480x272 pixels with LED backlight, and capacitive touch panel
  • 2-megapixel dual lane CSI-2 camera module with 15-pin FFC connector
  • Wi-Fi® 802.11b/g/n
  • Bluetooth® Low Energy 4.1

Discovery kit with STM32MP135F MPU


STM32MP15 boards
Boards PCBs list Main features Ordering
STM32MP157D-DK1.jpg
STM32MP157D-DK1 Discovery kit
  • MB1272C (motherboard)
  • STM32MP157DAC1[2] Rev.Z
    • Arm®-based dual Cortex®-A7 800 MHz
    • Basic security
    • 4-Gbit DDR3L, 16 bits, 533 MHz
  • ST PMIC STPMIC1APQR cut2.0

Discovery kit with STM32MP157D MPU

STM32MP157F-DK2.jpg
STM32MP157F-DK2 Discovery kit
  • MB1272C (motherboard)
  • MB1407B (daughterboard DSI display)
  • STM32MP157FAC1[2] Rev.Z
    • Arm®-based dual Cortex®-A7 800 MHz
    • Secure boot and cryptography
    • 4-Gbit DDR3L, 16 bits, 533 MHz
  • ST PMIC STPMIC1APQR cut2.0
  • 4" TFT 480×800 pixels with LED backlight, and capacitive touch panel
  • Wi-Fi® 802.11b/g/n
  • Bluetooth® Low Energy 4.1

Discovery kit with STM32MP157F MPU

STM32MP157D or F-EV1.jpg
STM32MP157D-EV1 Evaluation board
  • MB1262C (motherboard)
  • MB1263C (daughterboard)
  • MB1230C (daughterboard DSI display)
  • MB1379A (camera)
  • STM32MP157DAA1[2] Rev.Z
    • Arm®-based dual Cortex®-A7 800 MHz
    • Basic security
    • 2 × 4-Gbit DDR3L, 16 bits, 533 MHz
  • PMIC STPMIC1APQR cut2.0
  • 5.5" TFT 720×1280 pixels with LED backlight, and capacitive touch panel
  • 5-megapixel, 8-bit camera

Evaluation board with STM32MP157D MPU

STM32MP157D or F-EV1.jpg
STM32MP157F-EV1 Evaluation board
  • MB1262C (motherboard)
  • MB1263C (daughterboard)
  • MB1230C (daughterboard DSI display)
  • MB1379A (camera)
  • STM32MP157FAA1[2] Rev.Z
    • Arm®-based dual Cortex®-A7 800 MHz
    • Secure boot and cryptography
    • 2 × 4-Gbit DDR3L, 16 bits, 533 MHz
  • PMIC STPMIC1APQR cut2.0
  • 5.5" TFT 720×1280 pixels with LED backlight, and capacitive touch panel
  • 5-megapixel, 8-bit camera

Evaluation board with STM32MP157F MPU

STM32MP157A-DK1.jpg
STM32MP157A-DK1 Discovery kit
  • MB1272C (motherboard)
  • STM32MP157AAC3[2] Rev.B
    • Arm®-based dual Cortex®-A7 650 MHz
    • Basic security
    • 4-Gbit DDR3L, 16 bits, 533 MHz
  • ST PMIC STPMIC1APQR cut1.2

Out of production

STM32MP157C-DK2.jpg
STM32MP157C-DK2 Discovery kit
  • MB1272C (motherboard)
  • MB1407B (daughterboard DSI display)
  • STM32MP157CAC3[2] Rev.B
    • Arm®-based dual Cortex®-A7 650 MHz
    • Secure boot and cryptography
    • 4-Gbit DDR3L, 16 bits, 533 MHz
  • ST PMIC STPMIC1APQR cut1.2
  • 4" TFT 480×800 pixels with LED backlight, and capacitive touch panel
  • Wi-Fi® 802.11b/g/n
  • Bluetooth® Low Energy 4.1

Out of production

STM32MP157A or C-EV1.jpg
STM32MP157A-EV1 Evaluation board
  • MB1262C (motherboard)
  • MB1263C (daughterboard)
  • MB1230C (daughterboard DSI display)
  • MB1379A (camera)
  • STM32MP157AAA3[2] Rev.B
    • Arm®-based dual Cortex®-A7 650 MHz
    • Basic security
    • 2 × 4-Gbit DDR3L, 16 bits, 533 MHz
  • PMIC STPMIC1APQR cut1.2
  • 5.5" TFT 720×1280 pixels with LED backlight, and capacitive touch panel
  • 5-megapixel, 8-bit camera

Out of production

STM32MP157A or C-EV1.jpg
STM32MP157C-EV1 Evaluation board
  • MB1262C (motherboard)
  • MB1263C (daughterboard)
  • MB1230C (daughterboard DSI display)
  • MB1379A (camera)
  • STM32MP157CAA3[2] Rev.B
    • Arm®-based dual Cortex®-A7 650 MHz
    • Secure boot and cryptography
    • 2 × 4-Gbit DDR3L, 16 bits, 533 MHz
  • PMIC STPMIC1APQR cut1.2
  • 5.5" TFT 720×1280 pixels with LED backlight, and capacitive touch panel
  • 5-megapixel, 8-bit camera

Out of production



STM32MP25 boards
Boards PCBs list Main features Ordering
STM32MP257F-EV1.jpg
STM32MP257F-EV1 Evaluation board
  • Finished good VA32MP257F1$MR1
  • MB1936 (main board)
  • STM32MP257FAI3[3] Rev.Y
    • Arm®-based dual Cortex®-A35 1500 MHz
    • Secure boot and cryptography
    • 2 x 16-Gbit DDR4, 32 bits, 1200 MHz
  • PMIC STPMIC25 Cut1.1
  • Optional expansion boards
    • LVDS WSVGA display B-LVDS7-WSVGA board (finished good BLVDS7SVGA$PZ1)
    • 5-megapixel image sensor raw Bayer B-CAMS-IMX board (finished good BCAMSIMX$MZ1)
    • DSI to HDMI adapter Full HD 30fps B-LCDAD-HDMI1 board

Evaluation board with STM32MP257F MPU

STM32MP257F-DK.png
STM32MP257F-DK Discovery kit
  • Finished good DK32MP257F$AR1
  • MB1605 (main board)
  • STM32MP257FAI3[3] Rev.Y
    • Arm®-based dual Cortex®-A35 1500 MHz
    • Secure boot and cryptography
    • 32-Gbit LPDDR4, 32 bits, 1200 MHz
  • PMIC STPMIC25 Cut1.1
  • Optional expansion boards
    • LVDS WSVGA display B-LVDS7-WSVGA board (finished good BLVDS7SVGA$PZ1)
    • 5-megapixel image sensor raw Bayer B-CAMS-IMX board (finished good BCAMSIMX$MZ1)
Under construction.png Coming soon


5. Release content[edit source]

5.1. Main software components[edit source]

  • Build process
    • OpenEmbedded v4.2.4 (Mickledore) - Updated
    • GCC version v12.3.0 - Updated
  • Embedded software components
    • Linux kernel v6.1-stm32mp-r2 (v6.1.82) - Updated
    • TF-A v2.8-stm32mp-r2 - Updated
    • U-Boot v2022.10-stm32mp-r2 - Updated
    • OP-TEE 3.19.0-stm32mp-r2 - Updated
    • External DT 5.0-stm32mp-r1 - New
    • OpenOCD version v0.12.0 - Updated
  • Applicative components
    • Weston version v11.0.1 - Updated
    • Wayland version 1.21.0 - Updated
    • GStreamer version v1.22.6 - Updated
    • GCnano version v6.4.15 - Updated

5.2. Changes[edit source]

5.2.1. OpenSTLinux layers[edit source]

Changes are:‎

  • Rebase on Yocto Release 4.2.4 (Mickledore)
  • Support of STM32MP25x lines More info.png
  • Add external-dt support
  • Extlinux
    • Add support of FDTOVERLAYS via U-Boot
  • FIP
    • New frontend: now to generate FIP you need to call "bitbake fip-stm32mp" instead of asking "tf-a-stm32mp" to generate the FIP binaries via deploy command
    • Add support of STM32 MPU
      • Add FIP-DDR binaries generation
      • Add support of encryption
    • Support generation of FIP by configuration: OP-TEE : fastboot-sdcard, fastboot-emmc, optee-usb, ...
  • CONF/MACHINE
    • Add support of STM32MP25x lines More info.png and associated boards
      • stm32mp2 (generate binaries for both STM32MP257x-EV1 Evaluation board More info green.png and STM32MP257x-EV1 Evaluation board More info green.png boards)
      • stm32mp25-disco (For STM32MP257F-DK Discovery kit Warning.png)
      • stm32mp25-eval (For STM32MP257x-EV1 Evaluation board More info green.png)
    • Add fastboot support for all STM32 MPUs
    • Rename NAND storage
      • Nand-4-256-1024 (FMC NAND )
      • Nand-4-256-512 (SPI NAND )
      • Nand-2-128-256 (SPI NAND )
    • Add support of OP-TEE profiles
      • system_services
      • secure_and_system_services
    • Put SDK information on specific include file: st-image-sdk-stm32mp.inc
  • Components
    • Only for STM32MP25x lines More info.png:
      • Add M33projects
      • Add TF-M-stm32mp (To use only with external-dt OSLT)
      • Add DDR firmware (DDR firmware use by BL2- TF-A)
    • For STM32MP1 series and STM32MP25x lines More info.png
      • Add External DT mainly for STM32MP25x lines More info.png (used also for STM32MP1 series X-LINUX-RT Expansion Package)
      • OP-TEE: Add OP-TEE profiles
      • TF-A-TOOLS: Add wrapper to manage generation of FIP binaries: create_st_fip.sh‎
  • Minor fixes

5.2.2. Linux kernel[edit source]

New component release tag v6.1-stm32mp-r2 is available, rebased on official Linux® kernel v6.1.82.

Main changes have been done to support STM32MP25x lines More info.png

  • Storage:
    • OSPI Add DTR support and legacy SPI
  • Visual:
    • ADV7535 CEC support
    • Improve DCMIPP support
      • Pipes 1 & 2 - Flow Selection, Frame Control, Frame Counter & Stat removal
      • Down sizing without pixel alignment constraints
      • Add post-processing decimation support
    • H.264 Video Encoder
    • mprove Display support
      • Pre-processing - Cropping & rotation
      • Input RGB & YUV color formats
    • Add I3C controller (master) Linux® driver
    • LPUART support
  • Security
    • Add RISAF dump debug driver
    • Support crypt1 in TF-A, TF-M and cryp2 in TF-M, OP-TEE, U-Boot, and Linux
  • Analog:
    • Add MDF IIO support
  • Low power support
    • Add Linux®system suspend based on PSCI OSI
    • Suspend/resume support for Audio, LVDS, DSI, CSI, DCMIPP, GPU, Ethernet, PCIe, USB2/3
  • Core:
    • CoreSight support
    • DAM3 driver rework
    • Support IWDGX in all dedicated firmware
    • EXT-I: use interrupts-extended instead of interrupt-map
  • Minor fixes

5.2.3. U-Boot[edit source]

New component release tag v2022.10-stm32mp-r2 is available, rebased on official U-Boot v2022.10.

Changes are:

  • Firmware Update (FWU) support for metadata v2
  • Complete UEFI support
  • Update FASTBOOT support
  • Makefile to build the external device tree
  • STM32MP25x lines More info.png support
    • Support STM32MP257F-DK Discovery kit Warning.png and STM32MP257x-EV1 Evaluation board More info green.png
    • Hyperflash support
    • OSPI with Dual Transfer Rate support
    • power supply support for LVDS / DSI /LTDC
    • Add support backup registers with NVM
    • RIF semaphore handling in GPIO
    • IO synchronization parameters for pinctrl
  • Minor fixes

5.2.4. TF-A[edit source]

New component release tag v2.8-stm32mp-r2 is available, rebased on official TF-A v2.8 (LTS tag lts-v2.8.15).

Changes are:

  • Rebase on LTS-v2.8.15
  • Firmware Update (FWU) support for metadata v2 (metadata v1 support removed)
  • STM32MP25x lines More info.png support
    • Qdd NVMEM driver to manage TAMP backup registers
    • Add RIF, STPMIC2, OSPI and hyperflash support for STM32MP2
    • Several bug fixes in DDR, clocks, USB, OSPI, low-power, MMC, platform code and device tree
  • Minor fixes

5.2.5. OP-TEE[edit source]

New component release tag v3.19.0-stm32mp-r2 is available, rebased on official OP_TEE OS 3.19.0.

Changes are:

  • Add mailbox framework
  • Add NVMEM driver to manage TAMP backup registers
  • OP-TEE Profiles :
    • system services : PSCI, SCMI
    • secure and system services : PSCI, SCMI, TA and PTA support
  • STM32MP25x lines More info.png support:
    • Introduction of STM32MP25 platform
    • New drivers for STM32MP25 (Clock, BSEC3, RIFSC, RISAB, RISAB, SERC, IAC, IPCC, FMC, OMM)
    • RIF firewall configuration (peripheral and memory)
    • Power management
    • SCMI server from SCP firmware
    • SCMI OPP/DVFS support
    • SCMI regulator support (with PMIC and I2C secure)
    • Secure UI
  • Minor Fixes

5.2.6. External-DT[edit source]

NEW

New component release tag v5.0-stm32mp-r1 is available.

The external device tree component is used to host STM32 MPU embedded software device tree configurations in addition of the ones present in each software component (TF-A, OP-TEE, U-BOOT, LINUX, TF-M). It is Used for STM32MP25x lines More info.png, but not yet for STM32MP1 series.

6. Release change notification[edit source]

OpenSTLinux attention points to switch from ecosystem release v5.0.0 More info.png to ecosystem release v5.1.0 More info.png are documented in STM32 MPU OpenSTLinux release changes notification – v5.1.0 article.

7. Recommendations for use[edit source]

7.1. Safe use[edit source]

  • Flash programming and boot from all supported flash devices: SD card, eMMC, ONFI NAND and NOR flash memories.
  • Develop Linux® applications, libraries, kernel modules based on OpenSTLinux delivery.
  • Develop coprocessor Cube applications based on STM32CubeMP1 and STM32CubeMP2 deliveries.
  • Develop boards based on STM32MP1 series and STM32MP25x lines More info.png.
  • Prototype applications based on ST boards.

7.2. Non-recommended use[edit source]

  • None

8. Restrictions[edit source]

STM32MP25x lines More info.png

  • dcmipp-isp-ctrl tool will fail whenever DCMIPP auxiliary pipe only is used for camera capture (need to enable DCMIPP main pipe).

STM32MP1 series

  • The partition layout always keeps the Firmware Update related partitions even if machine feature fw-update is disabled. To optimize the partition layout without Firmware Update feature, modifications are needed on flashlayout file generation and also on U-Boot source code in case of MTD partitions (storage mapping is hardcoded for MTD partitions, see How_to_configure_U-Boot_for_your_board#MTD_partitions)
  • STM32MP15x lines More info.png: Issue to boot with SPI-Nand: patches to be upstreamed on GitHub

9. Minor release updates[edit source]

STMicroelectronics regularly delivers corrections through github® components which are U-Boot , OP-TEE , TF-A , Linux kernel .


The corrections can be incorporated into the STM32MP1 Developer Package or Distribution Package (see below).

Two possibilities exist to update a Distribution Package:

  • Update your existing Distribution Package:
Switch your Distribution Package to # github® mode .
  1. Use the devtool modify <recipe name> command to set up an environment. It fetches and unpacks the source code.
  2. In the extracted source code, use a git command such as git checkout -b WORK <github® TAG> to point to a new revision of the component.
More rarely, STMicroelectronics also delivers fixes on layers through github®. These changes can be integrated (via git commands: git checkout -b WORK <github® commit SHA1>) into the local STM32MP1 Distribution Package environment. See below the github® links of the quoted layers :
  • Get a new Distribution Package:
Refer to Installing_the_OpenSTLinux_distribution page for installing instructions, and use the repo command given for the minor version below, if it exists.

10. How to get started with openstlinux-6.1-yocto-mickledore-mpu-v24.06.26[edit source]

Refer to How to download the software and start with this release?

11. Associated tools[edit source]

Refer to the Referenced tools release notes .

12. Yocto features enabled in the delivery[edit source]

OpenEmbedded[4] build framework engine is named OE-Core.
OpenSTLinux distribution is based on the build framework OpenEmbedded, and can be configured thanks to a mechanism named "features" (machine features, distribution features, ...).

Depending on the features enabled, the resulting distribution can have more capabilities or software embedded.
For example, if the Wifi is enabled then the Wifi software and drivers are present on the filesystem and the Wifi can be used.

12.1. Machine features[edit source]

The variable MACHINE_FEATURES specifies the list of hardware features the machine is capable of supporting.
These features (MACHINE_FEATURES) are defined inside the machine configuration .

Machine feature Purpose
alsa Include ALSA support (OSS compatibility kernel modules installed if available).
autoresize Add support of autoresize through InitRD
bluetooth Add Broadcom43430 (Bluetooth) firmware to the filesystem
(STM32MP135x-DK Discovery kit More info green.png and STM32MP157x-DKx Discovery kit More info green.png)
ext2 Add Second Extended File System support
fip Enable Firmware In Package (FIP) packaging format
fw-update Enable Firmware update feature
gpu Add GPU support (if EULA is accepted) (STM32MP157 line More info.png only)
initrd Enable Intial ramdisk building
m4copro Add m4projects to userfs (STM32MP15x lines More info.png only)
optee Add OP-TEE Secure part
pci Add Peripheral Component Interconnect peripheral support
rtc Add Real Time Clock peripheral support
screen Add display screen peripheral support
splashscreen Add splashscreen to U-Boot
tpm2 Add Trusted Platform Module peripheral support
usbg0 Add G0 Firmware for USB support
usbgadget Enable USB Gadget feature
usbhost Enable USB Host feature
watchdog Add watchdog support and binaries
wifi Add Broadcom43430 (wifi) firmware to the filesystem
(STM32MP135x-DK Discovery kit More info green.png and STM32MP157x-DKx Discovery kit More info green.png)

12.2. Distribution features[edit source]

The variable DISTRO_FEATURES specifies the list of software features present in the distribution.
These features (DISTRO_FEATURES) are defined inside the distribution configuration .

Distribution feature Purpose
alsa Include ALSA support (OSS compatibility kernel modules installed if available).
argp
autoresize Add support of userfs auto resize feature in OpenSTLinux
bluetooth Include Bluetooth support
bluez5 Add Bluetooth stack
efi Add userland EFI tools
ext2 Add Second Extended File System support
ext4 Add Fourth Extended File System support
gobject-introspection-data Enable GObject Introspection, project for providing machine readable introspection data of the API of C libraries.
gplv3 Add gplv3 binaries in OpenSTLinux
gstreamer Add gstreamer tools in filesystem
initrd Add ramdisk
ipv4 Add ipv4 support
ipv6 Add ipv6 support
kde Add several tools (e.g. cups, fontconfig, ...) to the filesystem
largefile Enable large file support
ldconfig Include support for ldconfig and ld.so.conf on the target
multiarch Enable 64 bits BFD (Binary File Descriptor)
nfs Include NFS client support (for mounting NFS exports on device).
opengl Include the Open Graphics Library
optee Install tee service on the filesystem
pam Enable Pluggable Authentication Module
pci Add pci support
pulseaudio Network-capable sound server program
splashscreen Add U-Boot splashscreen
systemd Use systemd as init service
usbgadget USB Gadget Device support (for USB networking/serial/storage)
usbhost USB Host support (allows to connect external keyboard, mouse, storage, network etc)
wayland Add Wayland support
wifi WiFi support
xattr Add "Extended Attributes" support for filesystem
zeroconf Add zeroconf package to set up a ad-hoc network

12.3. Bootscheme labels[edit source]

The variable BOOTSCHEME_LABELS defines which kind of boot is supported on the board.
These settings (BOOTSCHEME_LABELS) are defined inside the machine configuration .

Bootscheme label Purpose
optee Add OP-TEE in boot scheme

12.4. Bootdevice labels[edit source]

The variable BOOTDEVICE_LABELS defines which kind of mass storage OpenSTLinux can program.
These settings (BOOTDEVICE_LABELS ) are defined inside the machine configuration .

Bootdevice label Purpose
emmc Add boot on eMMC device
nand-4-256 Add boot on NAND device
nor-sdcard Add boot stage on NOR device and the filesystem on SD card
sdcard Add boot on SD card