ST67W611M1 PCB stack-up options

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The ST67W611M1 module can be soldered on a mother PCB with the following characteristics:

• Type: FR4 - εr= 4.5

• 4-layer board

• PCB thickness: 12/10

• Cu: 35 μm

• Finish: ENIG

• Min hole size: 0.2 mm

• μVias, no buried vias.

An example of the board stack-up for the B2413 reference board, is shown in the table below.

Customers targeting a different stack-up are advised to make the necessary studies, simulations, and characterizations and contact STMicroelectronics support, if necessary.