STM32 MPU OpenSTLinux release note - v4.1.0

Applicable for

STM32MP13x lines, STM32MP15x lines

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This article describes the content of OpenSTLinux distribution software release version openstlinux-5.15-yocto-kirkstone-mp1-v22.11.23, which is part of the STM32 MPU ecosystem release note - v4.1.0.

1. Intended audience

The targeted audience is STM32MP13x lines  and STM32MP15x lines  customers or partners.

2. Delivery scope and purpose

The OpenSTLinux distribution is a Linux^® distribution based on the OpenEmbedded build Framework. It runs on the Arm^® Cortex^®-A7 processors, and is a fundamental part of the STM32MPU Embedded Software distribution. This delivery of OpenSTLinux distribution is part of STM32 MPU Ecosystem v4.1.0 (see the STM32 MPU ecosystem release note - v4.1.0).

3. Licensing

This software package is licensed under a LIMITED LICENSE AGREEMENT FOR ST MATERIALS EVALUATION (LLA). Customers may not use this package except in compliance with the software license agreement (SLA).

All packages use the same source components. All components and their respective licenses are listed here.

4. Supported hardware

This software delivery is compatible with the following boards:

STM32MP13 boards
Boards	PCBs list	Main features	Ordering
STM32MP135F-DK Discovery kit	MB1635 (motherboard) MB1897 (camera module board)	STM32MP135FAF7 Rev.Y Arm®-based Cortex®-A7 1 GHz Secure boot and cryptography 4-Gbit DDR3L, 16 bits, 533 MHz ST PMIC STPMIC1 4.3" TFT 480x272 pixels with LED backlight, and capacitive touch panel 2-megapixel dual lane CSI-2 camera module with 15-pin FFC connector Wi-Fi® 802.11b/g/n Bluetooth® Low Energy 4.1	Discovery kit with STM32MP135F MPU

STM32MP15 boards
Boards	PCBs list	Main features	Ordering
STM32MP157D-DK1 Discovery kit	MB1272C (motherboard)	STM32MP157DAC1 Rev.Z Arm®-based dual Cortex®-A7 800 MHz Basic security 4-Gbit DDR3L, 16 bits, 533 MHz ST PMIC STPMIC1APQR cut2.0	Discovery kit with STM32MP157D MPU
STM32MP157F-DK2 Discovery kit	MB1272C (motherboard) MB1407B (daughterboard DSI display)	STM32MP157FAC1 Rev.Z Arm®-based dual Cortex®-A7 800 MHz Secure boot and cryptography 4-Gbit DDR3L, 16 bits, 533 MHz ST PMIC STPMIC1APQR cut2.0 4" TFT 480×800 pixels with LED backlight, and capacitive touch panel Wi-Fi® 802.11b/g/n Bluetooth® Low Energy 4.1	Discovery kit with STM32MP157F MPU
STM32MP157D-EV1 Evaluation board	MB1262C (motherboard) MB1263C (daughterboard) MB1230C (daughterboard DSI display) MB1379A (camera)	STM32MP157DAA1 Rev.Z Arm®-based dual Cortex®-A7 800 MHz Basic security 2 × 4-Gbit DDR3L, 16 bits, 533 MHz PMIC STPMIC1APQR cut2.0 5.5" TFT 720×1280 pixels with LED backlight, and capacitive touch panel 5-megapixel, 8-bit camera	Evaluation board with STM32MP157D MPU
STM32MP157F-EV1 Evaluation board	MB1262C (motherboard) MB1263C (daughterboard) MB1230C (daughterboard DSI display) MB1379A (camera)	STM32MP157FAA1 Rev.Z Arm®-based dual Cortex®-A7 800 MHz Secure boot and cryptography 2 × 4-Gbit DDR3L, 16 bits, 533 MHz PMIC STPMIC1APQR cut2.0 5.5" TFT 720×1280 pixels with LED backlight, and capacitive touch panel 5-megapixel, 8-bit camera	Evaluation board with STM32MP157F MPU
STM32MP157A-DK1 Discovery kit	MB1272C (motherboard)	STM32MP157AAC3 Rev.B Arm®-based dual Cortex®-A7 650 MHz Basic security 4-Gbit DDR3L, 16 bits, 533 MHz ST PMIC STPMIC1APQR cut1.2	Out of production
STM32MP157C-DK2 Discovery kit	MB1272C (motherboard) MB1407B (daughterboard DSI display)	STM32MP157CAC3 Rev.B Arm®-based dual Cortex®-A7 650 MHz Secure boot and cryptography 4-Gbit DDR3L, 16 bits, 533 MHz ST PMIC STPMIC1APQR cut1.2 4" TFT 480×800 pixels with LED backlight, and capacitive touch panel Wi-Fi® 802.11b/g/n Bluetooth® Low Energy 4.1	Out of production
STM32MP157A-EV1 Evaluation board	MB1262C (motherboard) MB1263C (daughterboard) MB1230C (daughterboard DSI display) MB1379A (camera)	STM32MP157AAA3 Rev.B Arm®-based dual Cortex®-A7 650 MHz Basic security 2 × 4-Gbit DDR3L, 16 bits, 533 MHz PMIC STPMIC1APQR cut1.2 5.5" TFT 720×1280 pixels with LED backlight, and capacitive touch panel 5-megapixel, 8-bit camera	Out of production
STM32MP157C-EV1 Evaluation board	MB1262C (motherboard) MB1263C (daughterboard) MB1230C (daughterboard DSI display) MB1379A (camera)	STM32MP157CAA3 Rev.B Arm®-based dual Cortex®-A7 650 MHz Secure boot and cryptography 2 × 4-Gbit DDR3L, 16 bits, 533 MHz PMIC STPMIC1APQR cut1.2 5.5" TFT 720×1280 pixels with LED backlight, and capacitive touch panel 5-megapixel, 8-bit camera	Out of production

5. Release content

5.1. Main software components

• Build process
  • OpenEmbedded v4.0.4 (Kirkstone) - Updated
  • GCC version v11.3.0 - Updated
• Embedded software components
  • Linux kernel v5.15-stm32mp-r2 (v5.15.67) - Updated
  • TF-A v2.6-stm32mp-r2 - Updated
  • U-Boot v2021.10-stm32mp-r2 - Updated
  • OP-TEE 3.16.0-stm32mp-r2 - Updated
  • OpenOCD version v0.11.0
• Applicative components
  • Weston version v10.0.2 - Updated
  • Wayland version 1.20.0
  • GStreamer version v1.20.3 - Updated
  • GCnano version v6.4.9 - Updated

5.2. Changes

5.2.1. OpenSTLinux layers

Changes are:‎

• Rebase on Yocto LTS Release 4.0.4 (Kirkstone)
• Add support of Firmware Update feature for NAND memory
• Add Arm® Cortex®-A7 and Arm® Cortex®-M4 examples in Starter Package for STM32MP157D-DK1
• Move Arm® Cortex®-A7 and Arm® Cortex®-M4 examples from STM32MP157C-DK2 to STM32MP157F-DK2
• Increase default rootfs ext4 partition size: 3GB for eMMC and 4GB for Micro SD Card
• Minor fixes

Information

From prevous major release OpenSTLinux v4.0.0, FIP configuration is the only packaging format supported for boot loaders (more about FIP here) : Only TF-A BL2 requires the stm32 header for a ROM code authentication. Others bootloader binaries are embedded in a FIP container. A dedicated fip-utils-stm32mp.bbclass class is provided on meta-st-stm32mp layer side to manage the FIP image configuration, build and update.

5.2.2. Linux^® kernel

New component release tag 5.15-stm32mp-r2 is available, rebased on official Linux^® kernel v5.15.67.

Changes are:‎

• Real Time ready drivers (RT-Linux)
• SPI slave support
• ADC oversampling support
• SPI master driver with dual-qspi mode support
• DMA support for CRYP IP (Crypto performance improvement)
• STM32MP13x lines :
  • New wake up sources
    • USB OTG wake up via STM32G0
    • Ethernet PHY Wakeup on LAN
• Minor fixes

5.2.3. U-Boot

New component release tag 2021.10-stm32mp-r2 is available, rebased on official U-Boot v2021.10.

Changes are:

• Fix support of STM32MP13x Rev.Y
• Device tree alignment with Linux Kernel v5.15-stm32mp-r2
• Remove tests on CONFIG_DM_REGULATOR
• Fix invalid clock name references in SCMI driver
• Make usage of clock/reset bulk() API in USB EHCI driver
• Fix the display of protected GPIO in gpio and pinmux command
• Display label for gpio in alternate mode in gpio status command
• Fixes for stm32prog command:

• Correctly handle OTP when SMC is not supported
• Support empty flashlayout

• Several fixes for STM32MP13 clock
• Use correct compatible string to add MTD partitions int ft_board_setup()
• Check fdtcontroladdr in label_boot for pxe command parsing, used on extlinux.conf for GENERIC DISTRO support
• Use RGB565 for BMP blitting, as panel configuration
• Several STM32 I2C corrections
• Other minor updates

Information

The U-Boot defconfig to use for ecosystem release ≥ v4.0.0 changed to stm32mp15_defconfig.

Warning

SPL and STM32Image is not supported anymore in OpenSTLinux U-Boot. Migrate to TF-A with FIP support instead.

5.2.4. TF-A

New component release tag 2.6-stm32mp-r2 is available, rebased on official TF-A v2.6.

Changes are:

• Firmware update on NAND devices
• Improve FIP management on NAND devices
• Add GPIO regulators driver
• Use FCONF to manage the Chain of Trust
• Allow support of non-paged OP-TEE
• Skip boot devices initialization when returning from Standby (only with OP-TEE)
• Minor fixes

5.2.5. OP-TEE

New component release tag 3.16.0-stm32mp-r2 is available, rebased on official OP_TEE OS 3.16.0.

Changes are:

• ADC driver implementation
• IRQ forwarding
• Update regulator IO management
• Hardware unique key (HUK) implementation:

• using secured OTP through BSEC driver mapping on STM32MP15
• through SAES on STM32MP13

• Minor Fixes

6. Release change notification

OpenSTLinux attention points to switch from ecosystem release v4.0.0 to ecosystem release v4.1.0 are documented in STM32 MPU OpenSTLinux release changes notification – v4.1.0 article.

7. Recommendations for use

7.1. Safe use

• Flash programming and boot from all supported flash devices: SDCard, eMMC, ONFI NAND and NOR flash memories.
• Develop Linux^® applications, libraries, kernel modules based on OpenSTLinux delivery.
• Develop coprocessor Cube applications based on STM32CubeMP1 delivery.
• Develop boards based on STM32MP1 Series.
• Prototype applications based on ST boards.

7.2. Non-recommended use

• None

8. Restrictions

• If Firmware Update is not enabled, and the flashlayout partition is not needed anymore, but the storage mapping is hardcoded in U-Boot; either the flashlayout keeps the partitions for Firmware Update feature or U-Boot needs to be updated.

Warning

On an Ubuntu 18.04 (with a host gcc version prior to 8.0), U-Boot cannot be built by using the STM32MP1_Developer_Package because the option : -fmacro-prefix-map , used in U-Boot is not supported by Ubuntu 18.04

9. Minor release updates

STMicroelectronics regularly delivers corrections through github^® components which are U-Boot, OP-TEE, TF-A, Linux kernel.
The corrections can be incorporated into the Developer Package (refer to STM32MP1 Developer Package) or Distribution Package (see below).

Two possibilities exist to update a Distribution Package:

• Update your existing Distribution Package:

Switch your Distribution Package to # github^® mode .

1. Use the devtool modify <recipe name> command to set up an environment. It fetches and unpacks the source code.
2. In the extracted source code, use a git command such as git checkout -b WORK <github^® TAG> to point to a new revision of the component.

More rarely STMicroelectronics also delivers fixes on layers through github^®. These changes can be integrated (via git commands: git checkout -b WORK <github^® commit SHA1>) into the local STM32MP1 Distribution Package environment. See below the github^® links of the quoted layers :

• meta-st-stm32mp
• meta-st-openstlinux
• meta-st-stm32mp-addons

• Get a new Distribution Package:

Refer to Installing_the_OpenSTLinux_distribution page for install instructions, and use the repo command given for the minor version below, if it exists.

9.1. v4.1.2

• Update to Yocto Project 4.0.19 (2022-04.19-kirkstone)
• Update to Linux Kernel 5.15.145
• BSP maturation with an amount of 17 fixes delivered BSP components (TF-A, u-Boot, OP-TEE and Linux Kernel)
• BSP update:

Layer name	github® commit SHA1 reference
meta-st-stm32mp	b7accec80a2903c75d4129cf2b3bf6e15f5410c0
meta-st-openstlinux	613b158e6ee5b575e7de1251eae389c72e376043

• Component update:

Component	Recipe name	new github® release
tf-a	tf-a-stm32mp	v2.6-stm32mp-r2.2
u-boot	u-boot-stm32mp	v2021.10-stm32mp-r2.2
kernel	linux-stm32mp	v5.15-stm32mp-r2.2
optee-os	optee-os-stm32mp	3.16.0-stm32mp-r2.2

• New manifest tag available to get the release: openstlinux-5.15-yocto-kirkstone-mp1-v24.07.17

repo init -u https://github.com/STMicroelectronics/oe-manifest -b refs/tags/openstlinux-5.15-yocto-kirkstone-mp1-v24.07.17
repo sync

9.2. v4.1.1

• Update to Yocto Project 4.0.11 (2022-04.11-kirkstone)
• Update to Linux Kernel 5.15.118
• BSP maturation with an amount of 49 fixes delivered BSP components (TF-A, u-Boot, OP-TEE and Linux Kernel)
• BSP update:

Layer name	github® commit SHA1 reference
meta-st-stm32mp	ef4a6a785d17b4370cd20402b351a17ed34cd74d
meta-st-openstlinux	03daeb62ccffa2e29c20ee97154dc18dda4fbd60

• Component update:

Component	Recipe name	new github® release
tf-a	tf-a-stm32mp	v2.6-stm32mp-r2.1
u-boot	u-boot-stm32mp	v2021.10-stm32mp-r2.1
kernel	linux-stm32mp	v5.15-stm32mp-r2.1
optee-os	optee-os-stm32mp	3.16.0-stm32mp-r2.1"

• New manifest tag available to get the release: openstlinux-5.15-yocto-kirkstone-mp1-v23.07.26

repo init -u https://github.com/STMicroelectronics/oe-manifest -b refs/tags/openstlinux-5.15-yocto-kirkstone-mp1-v23.07.26
repo sync

10. How to get started with openstlinux-5.15-yocto-kirkstone-mp1-v22.11.23

Refer to How to download the software and start with this release?

11. Associated tools

Refer to the Referenced tools release notes .

12. Yocto features enabled in the delivery

OpenEmbedded build framework engine is named OE-Core.
OpenSTLinux distribution is based on the build framework OpenEmbedded, and can be configured thanks to a mechanism named "features" (machine features, distribution features, ...).

Depending on the features enabled, the resulting distribution can have more capabilities or software embedded.
For example, if the wifi is enabled then the wifi software and drivers are present on the filesystem and the wifi can be used.

12.1. Machine features

The variable MACHINE_FEATURES specifies the list of hardware features the machine is capable of supporting.
These features (MACHINE_FEATURES) are defined inside the machine configuration .

Machine feature	Purpose
alsa	Include ALSA support (OSS compatibility kernel modules installed if available).
autoresize	Add support of autoresize through InitRD
bluetooth	Add Broadcom43430 (Bluetooth) firmware to the filesystem (STM32MP135x-DK Discovery kit and STM32MP157x-DKx Discovery kit )
ext2	Add Second Extended File System support
fip	Enable Firmware In Package (FIP) packaging format
fw-update	Enable Firmware update feature
gpu	Add GPU support (if EULA is accepted) (STM32MP157 line  only)
initrd	Enable Intial ramdisk building
m4copro	Add m4projects to userfs (STM32MP15x lines  only)
optee	Add OP-TEE Secure part
pci	Add Peripheral Component Interconnect peripheral support
rtc	Add Real Time Clock peripheral support
screen	Add display screen peripheral support
splashscreen	Add splashscreen to U-Boot
tpm2	Add Trusted Platform Module peripheral support
usbg0	Add G0 Firmware for USB support
usbgadget	Enable USB Gadget feature
usbhost	Enable USB Host feature
watchdog	Add watchdog support and binaries
wifi	Add Broadcom43430 (wifi) firmware to the filesystem (STM32MP135x-DK Discovery kit and STM32MP157x-DKx Discovery kit )

12.2. Distribution features

The variable DISTRO_FEATURES specifies the list of software features present in the distribution.
These features (DISTRO_FEATURES) are defined inside the distribution configuration .

Distribution feature	Purpose
alsa	Include ALSA support (OSS compatibility kernel modules installed if available).
argp
autoresize	Add support of userfs auto resize feature in OpenSTLinux
bluetooth	Include Bluetooth support
bluez5	Add Bluetooth stack
efi	Add userland EFI tools
ext2	Add Second Extended File System support
ext4	Add Fourth Extended File System support
gobject-introspection-data	Enable GObject Introspection, project for providing machine readable introspection data of the API of C libraries.
gplv3	Add gplv3 binaries in OpenSTLinux
gstreamer	Add gstreamer tools in filesystem
initrd	Add ramdisk
ipv4	Add ipv4 support
ipv6	Add ipv6 support
kde	Add several tools (e.g. cups, fontconfig, ...) to the filesystem
largefile	Enable large file support
ldconfig	Include support for ldconfig and ld.so.conf on the target
multiarch	Enable 64 bits BFD (Binary File Descriptor)
nfs	Include NFS client support (for mounting NFS exports on device).
opengl	Include the Open Graphics Library
optee	Install tee service on the filesystem
pam	Enable Pluggable Authentication Module
pci	Add pci support
polkit	Enable PolicyKit for controlling system-wide privileges
pulseaudio	Network-capable sound server program
splashscreen	Add U-Boot splashscreen
systemd	Use systemd as init service
usbgadget	USB Gadget Device support (for USB networking/serial/storage)
usbhost	USB Host support (allows to connect external keyboard, mouse, storage, network etc)
wayland	Add Wayland support
wifi	WiFi support
xattr	Add "Extended Attributes" support for filesystem
zeroconf	Add zeroconf package to set up a ad-hoc network

12.3. Bootscheme labels

The variable BOOTSCHEME_LABELS defines which kind of boot is supported on the board.
These settings (BOOTSCHEME_LABELS) are defined inside the machine configuration .

Bootscheme label	Purpose
optee	Add optee in bootscheme
trusted	Add trusted in bootscheme

12.4. Bootdevice labels

The variable BOOTDEVICE_LABELS defines which kind of mass storage OpenSTLinux can programmed.
These settings (BOOTDEVICE_LABELS ) are defined inside the machine configuration .

Bootdevice label	Purpose
emmc	Add boot on emmc device
nand-4-256	Add boot on NAND device
nor-sdcard	Add boot stage on NOR device and the filesystem on SD-Card
sdcard	Add boot on SD-Card

Linux^® is a registered trademark of Linus Torvalds.

Arm^® is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

Cortex^®

Microprocessor unit

Power management integrated circuit

Light-emitting diode

MIPI camera serial interface 2

Technology for wireless local area networking with devices based on the IEEE 802.11 standards

Display serial interface (MIPI^® Alliance standard)

Trusted firmware for Arm^® Cortex^®-A

Das U-Boot -- the universal boot loader (see U-Boot)

Open portable trusted execution environment

Former spelling for e•MMC ('e' in italic)

Secure digital

Firmware image package is a packaging format used by TF-A

Boot loader stage 2

Read only memory

Real-time

Serial peripheral interface

Analog-to-digital converter. The process of converting a sampled analog signal to a digital code that represents the amplitude of the original signal sample.

Direct memory access

Cryptographic processor

USB on-the-go (Capability/type of USB port, acting primarily as USB device, to also act as USB host. Also known as USB OTG.)

System control and management interface

Application programming interface

Enhanced host controller interface

General-purpose input/output (A realization of open ended transmission between devices on an embedded level. These pins available on a processor can be programmed to be used to either accept input or provide output to external devices depending on user desires and applications requirements.)

One time programmed

Secure monitor call

Memory technology device

Inter-integrated circuit (Bi-directional 2-wire bus standard for efficient inter-IC control.)

Secondary program loader, Also known as U-Boot SPL

Firmware configuration framework used by TF-A - NEW

Trusted execution environment

Operating system

input/output

Hardware unique Key

Boot and Security and OTP control

Flash memory shortened to gain space in titles, tables and block diagrams

Open NAND flash interface (The ONFI working group, acronym for Open NAND flash interface, was founded in 2005. The group’s mission consists in creating a common industry standard for NAND Flash interfaces, to simplify integration of NAND Flash memory into consumer electronics (CE) devices and computing platforms. ST is one of the co-founder companies together with Hynix, Intel, Micron, Phison and Sony.)

The Linux Foundation® and Yocto Project® are registered trademarks of the Linux Foundation. Linux® is a registered trademark of Linux Torvalds

Board support package

Advanced Linux sound architecture

Open source software

Graphics processing units

Initial ramdisk (https://en.wikipedia.org/wiki/Initial_ramdisk)

Network file system (https://en.wikipedia.org/wiki/Network_File_System)

Linux^® is a registered trademark of Linus Torvalds.

Arm^® is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

Cortex^®

Microprocessor unit

Power management integrated circuit

Light-emitting diode

MIPI camera serial interface 2

Technology for wireless local area networking with devices based on the IEEE 802.11 standards

Display serial interface (MIPI^® Alliance standard)

Trusted firmware for Arm^® Cortex^®-A

Das U-Boot -- the universal boot loader (see U-Boot)

Open portable trusted execution environment

Former spelling for e•MMC ('e' in italic)

Secure digital

Firmware image package is a packaging format used by TF-A

Boot loader stage 2

Read only memory

Real-time

Serial peripheral interface

Analog-to-digital converter. The process of converting a sampled analog signal to a digital code that represents the amplitude of the original signal sample.

Direct memory access

Cryptographic processor

USB on-the-go (Capability/type of USB port, acting primarily as USB device, to also act as USB host. Also known as USB OTG.)

System control and management interface

Application programming interface

Enhanced host controller interface

General-purpose input/output (A realization of open ended transmission between devices on an embedded level. These pins available on a processor can be programmed to be used to either accept input or provide output to external devices depending on user desires and applications requirements.)

One time programmed

Secure monitor call

Memory technology device

Inter-integrated circuit (Bi-directional 2-wire bus standard for efficient inter-IC control.)

Secondary program loader, Also known as U-Boot SPL

Firmware configuration framework used by TF-A - NEW

Trusted execution environment

Operating system

input/output

Hardware unique Key

Boot and Security and OTP control

Flash memory shortened to gain space in titles, tables and block diagrams

Open NAND flash interface (The ONFI working group, acronym for Open NAND flash interface, was founded in 2005. The group’s mission consists in creating a common industry standard for NAND Flash interfaces, to simplify integration of NAND Flash memory into consumer electronics (CE) devices and computing platforms. ST is one of the co-founder companies together with Hynix, Intel, Micron, Phison and Sony.)

The Linux Foundation® and Yocto Project® are registered trademarks of the Linux Foundation. Linux® is a registered trademark of Linux Torvalds

Board support package

Advanced Linux sound architecture

Open source software

Graphics processing units

Initial ramdisk (https://en.wikipedia.org/wiki/Initial_ramdisk)

Network file system (https://en.wikipedia.org/wiki/Network_File_System)

Mobile Industry Processor Interface, open membership organization that includes leading companies in the mobile industry that share the objective of defining and promoting open specifications for interfaces inside mobile terminals, see MIPI^® Alliance standard web site https://www.mipi.org

Multimedia card

Flash memories combine high density and cost effectiveness of EPROMs with the electrical erasability of EEPROMs. For this reason, the Flash memory market is one of the most exciting areas of the semiconductor industry today and new applications requiring in system reprogramming, such as cellular telephones, automotive engine management systems, hard disk drives, PC BIOS software for Plug & Play, digital TV, set top boxes, fax and other modems, PC cards and multimedia CD-ROMs, offer the prospect of very high volume demand.